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Added MPM for Flysky PL18 PCB and casing design. (#754)

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richardclli
2022-11-17 18:37:11 +08:00
committed by GitHub
parent c95db35b41
commit c80f705fa2
14 changed files with 101830 additions and 0 deletions
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42
STM32 PCB/Flysky PL18/PL18_multiprotocol/Multi.pretty/DS-B01F-A-S2.kicad_mod Normal file
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(footprint "DS-B01F-A-S2" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 59FED5CC)
(descr "Through hole straight pin header, 1x05, 2.54mm pitch, single row")
(tags "Through hole pin header THT 1x05 2.54mm single row")
(attr through_hole)
(fp_text reference "REF**" (at -0.25 -4.75) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp d518c7db-9a4d-4905-902c-7b6d95f659cb)
)
(fp_text value "DS-B01F-A-S2" (at 0 12.49) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 614f538e-5f2b-401d-b0ab-3346d3ff44e4)
)
(fp_text user "${REFERENCE}" (at 0 5.08 90) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 9586cda1-48da-45c7-86f7-751657e7c25a)
)
(fp_line (start -4.5 13.5) (end 1.25 13.5) (layer "F.SilkS") (width 0.12) (tstamp 05393a00-de07-40a8-8064-67c0a8a1e9ef))
(fp_line (start 1.25 -3.5) (end 1.25 13.5) (layer "F.SilkS") (width 0.12) (tstamp 09bf1fa9-9ec6-4d5c-bed9-fcd1fe76bd8e))
(fp_line (start -4.5 -3.5) (end 1.25 -3.5) (layer "F.SilkS") (width 0.12) (tstamp 2f1dd441-3cdc-4eed-9839-dc1fa6a931ba))
(fp_line (start -4.5 -3.5) (end -4.5 13.5) (layer "F.SilkS") (width 0.12) (tstamp 35bb1bb5-998b-4ce9-a139-e009425d4e40))
(fp_line (start -4.5 -3.5) (end -4.5 13.5) (layer "F.CrtYd") (width 0.05) (tstamp 346ee0d3-e13a-49f6-8f6c-eb860777d6c4))
(fp_line (start 1.25 13.5) (end 1.25 -3.5) (layer "F.CrtYd") (width 0.05) (tstamp 93808e54-10fb-4c6c-984b-3a91c36dbafa))
(fp_line (start 1.25 -3.5) (end -4.5 -3.5) (layer "F.CrtYd") (width 0.05) (tstamp d7a0888c-6be2-4a97-ac01-de345dcd2919))
(fp_line (start -4.5 13.5) (end 1.25 13.5) (layer "F.CrtYd") (width 0.05) (tstamp ee85719d-9f71-411e-a024-43105a50c262))
(fp_line (start -1.27 11.43) (end -1.27 -0.635) (layer "F.Fab") (width 0.1) (tstamp 085f4818-84f1-415f-823e-e6076d0e732d))
(fp_line (start -1.27 -0.635) (end -0.635 -1.27) (layer "F.Fab") (width 0.1) (tstamp 602c4495-9f5f-4ae3-9800-df18526e3c50))
(fp_line (start 1.27 -1.27) (end 1.27 11.43) (layer "F.Fab") (width 0.1) (tstamp 73eb4832-b804-463c-ae2b-563755d89978))
(fp_line (start -0.635 -1.27) (end 1.27 -1.27) (layer "F.Fab") (width 0.1) (tstamp aed66e63-a453-441e-94eb-3442ef294c72))
(fp_line (start 1.27 11.43) (end -1.27 11.43) (layer "F.Fab") (width 0.1) (tstamp dde86203-069d-47dc-8693-34fe614da099))
(pad "1" thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (tstamp 174ecd2f-6484-485c-a83d-71d6a1dc733a))
(pad "2" thru_hole oval (at 0 2.5) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (tstamp 997a59d1-7e2b-4400-b74b-3cb21ad33038))
(pad "3" thru_hole oval (at 0 5) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (tstamp 7aa5c04b-5bd3-4c72-bbaf-9ec87c5447e0))
(pad "4" thru_hole oval (at 0 7.5) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (tstamp 8a6c42bd-bf44-40be-9e58-41dc76d10644))
(pad "5" thru_hole oval (at 0 10) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (tstamp c1741286-ba0e-4f33-8f37-5fd51504bac5))
(model "${KICAD6_3DMODEL_DIR}/Connector_PinHeader_2.54mm.3dshapes/PinHeader_1x05_P2.54mm_Vertical.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

60
STM32 PCB/Flysky PL18/PL18_multiprotocol/Multi.pretty/MULTIRF4IN1-SMT.kicad_mod Normal file
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@@ -0,0 +1,60 @@
(footprint "MULTIRF4IN1-SMT" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 0)
(fp_text reference "REF**" (at 0 -0.75) (layer "F.SilkS")
(effects (font (size 1.27 1.27) (thickness 0.15)))
(tstamp c70c9e03-6ffa-4ea8-9291-15d2673122a0)
)
(fp_text value "Val**" (at 0 1) (layer "F.Fab")
(effects (font (size 1.27 1.27) (thickness 0.15)))
(tstamp c3246ecf-81bc-4b14-94a2-7b86227cabaf)
)
(fp_line (start -13 11.9) (end -13 17) (layer "F.SilkS") (width 0.12) (tstamp 21d8aff3-5b17-43c7-9d08-4e33edbcbeb9))
(fp_line (start -13 3.4) (end -13 8.1) (layer "F.SilkS") (width 0.12) (tstamp 4a2c9e01-3f0b-4116-a39b-baa7e7b94b8a))
(fp_line (start -13 -8.1) (end -13 -2.4) (layer "F.SilkS") (width 0.12) (tstamp 960baeae-d7ca-4f76-ac15-6cd68f041702))
(fp_line (start 13 -17) (end 13 -13.9) (layer "F.SilkS") (width 0.12) (tstamp a22c44ee-0c9a-42e0-81e0-94f90a0da388))
(fp_line (start 13 11.9) (end 13 17) (layer "F.SilkS") (width 0.12) (tstamp a8050edb-a9eb-479e-abea-105077de87b8))
(fp_line (start -13 -17) (end -13 -11.9) (layer "F.SilkS") (width 0.12) (tstamp dbeb96d9-bbc7-4dae-ba00-6746209bdc43))
(fp_line (start 13 -17) (end -13 -17) (layer "F.SilkS") (width 0.12) (tstamp de173627-aedf-48e0-8674-66cfe17b969a))
(fp_line (start 13 17) (end -13 17) (layer "F.SilkS") (width 0.12) (tstamp edb180b5-b35e-4fa4-8440-d021574908ae))
(pad "CE_2401" smd rect (at 12.49 -13) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp 177c8408-9b8a-453c-871a-7a335239833a))
(pad "CS_2401" smd rect (at 12.49 -1) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp deb3cbb7-c404-4161-b154-3014395e2a30))
(pad "CS_2500" smd rect (at 12.49 1) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp e8ecba2d-0746-43bc-b641-9cc180ff9253))
(pad "CS_6936" smd rect (at 12.49 -3) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp 90314976-271d-4f34-b2f0-dff6de6b86e7))
(pad "CS_7105" smd rect (at 12.49 3) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp 1f154bf6-42ea-456f-89ac-fed01ff7208b))
(pad "GND" smd rect (at 12.49 9) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp 14373cb3-8424-453e-b0d3-1a6022ea35b1))
(pad "GND@1" smd rect (at -12.49 -11) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp b15a1378-3e57-41cb-96b2-030f4848402c))
(pad "GND@2" smd rect (at -12.49 -9) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp 71e83330-d2fe-4680-bbc4-fbbb511ecf3d))
(pad "GND@3" smd rect (at -12.49 -1.5) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp 27f29ad7-d4f7-416a-bc00-7c36c9ffbaca))
(pad "GND@4" smd rect (at -12.49 2.5) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp 6b446947-9739-4960-abfc-ef89034a0437))
(pad "GND@5" smd rect (at -12.49 9) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp 589b3137-9b71-4e00-93fe-63222c56ecc3))
(pad "GND@6" smd rect (at -12.49 11) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp 371c3d69-e48f-46fb-a1b6-b681b17bacb1))
(pad "MISO" smd rect (at 12.49 -9) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp a1ef8d67-bdf4-443e-88f7-406670c2aef9))
(pad "MOSI" smd rect (at 12.49 -7) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp d9f5d5e2-2571-4cc2-800c-f5758bd5695f))
(pad "PE1" smd rect (at 12.49 7) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp 06684ce2-c9de-48bf-9621-ada44ca8a12c))
(pad "PE2" smd rect (at 12.49 5) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp bd470244-7da3-4d59-894b-19e4071da146))
(pad "RF" smd rect (at -12.49 0.5) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp e91e6b83-902b-42be-92fa-6ac19487af54))
(pad "RST_CYFR" smd rect (at 12.49 -11) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp dc86e8ca-1f6b-4f0d-9576-5c57346768bf))
(pad "SCK" smd rect (at 12.49 -5) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp 483e384c-d6af-490d-b4f9-371490f0e46f))
(pad "VCC" smd rect (at 12.49 11) (size 1.52 1.27) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1) (tstamp 8796d68c-81fa-42ef-ace9-9d8c76827e59))
)