Automated build process updates (#950)

* 4-in-1 air and surface builds

* Disable serial and PPM-only builds for STM32 x-in-1

* More air and surface builds

* Fix 5-in-1 tests

* T18 air, surface, and LBT builds

* Remove CFlie from DIY 5-in-1 AIR

* Bump action versions

* v4 artifact merging

* Improve artifact merge

* Fix merge

* DIY 5-in-1 LBT

* Tweak CI job name

* Add T-Lite 5-in-1 LBT

* CI job restructure

buildroot/bin/build_release_stm32f1_4in1_native_debug

@@ -0,0 +1,13 @@
+#!/usr/bin/env bash
+
+source ./buildroot/bin/buildFunctions;
+exitcode=0;
+
+printf "\e[33;1mBuilding mm-stm-xn297dump-usbdebug-v$MULTI_VERSION.bin\e[0m\n";
+opt_disable $ALL_PROTOCOLS;
+opt_add XN297DUMP_NRF24L01_INO;
+buildMulti;
+exitcode=$((exitcode+$?));
+mv build/Multiprotocol.ino.bin ./binaries/mm-stm-xn297dump-usbdebug-v$MULTI_VERSION.bin;
+
+exit $exitcode;